MediaTek introduces Dimensity 8100 and Dimensity 8000 SoCs for premium mobiles

These processors are aimed at the premium segment of mobile phones with 5G connectivity, along with another lower-end one, Dimensity 1300, all of them about to hit the market.





MediaTek has presented this Monday two new processors, the Dimensity 8100 and Dimensity 8000 models, aimed at the premium segment of mobile phones with 5G connectivity, along with another lower-end one, Dimensity 1300, all of them about to hit the market.

The two systems on chip (SoC) incorporate Dimensity 9000 processor technology, although unlike this Dimensity 8100 and Dimensity 8000 are manufactured with a 5 nanometer process , as stated in a statement.

In detail

Both the Dimensity 8100 and Dimensity 8000 consist of eight cores. The first SoC includes four Arm Cortex-A78 cores that reach speeds of 2.85GHz, while the other features four Cortex-A78 cores at 2.75GHz. Both integrate an Arm Mali-G610 MC6 GPU.

These new processors use MediaTek HyperEngine 5.0 technology, which improves energy efficiency during video game play ; They support four-channel LPDDR5 type RAM and UFS 3.1 storage.

In the photographic section, Dimensity 8100 supports 170 frames per second (fps), while Dimensity 8000 supports 140fps . Both support cameras up to 200 megapixels and have in-house technology that reduces noise in images and improves quality in low light conditions.

In the photographic section, Dimensity 8100 supports 170 frames per second (fps), while Dimensity 8000 supports 140fps . Both support cameras up to 200 megapixels and have in-house technology that reduces noise in images and improves quality in low light conditions.

In video, they offer video recording in 4K60 HDR10 +, and support the function of dual recording in HDR , which allows you to record at the same time with the front and rear cameras or with two different lenses in multiple camera systems.



The importance of 5G

The SoCs integrate a 5G modem, 5G UltraSave 2.0 technology to improve efficiency, and support for WiFi 6E and Bluetooth 5.3. Phones that integrate the new Dimensity 8100 and Dimensity 8000 processors will begin to hit the market in the first quarter of this year.

On the other hand, the technology company has also presented the Dimensity 1300 chip, 6 nanometers and with 5G connectivity, which offers support for cameras of up to 200 megapixels and improvements based on artificial intelligence.

The Dimensity 1300 is made up of eight cores: a 3GHz Arm Cortex-A78, three Arm Cortex-A78s, and four Arm Cortex-A55s, along with an Arm Mali-G77 GPU. It will begin to reach the market with the mobiles that are marketed in the first quarter of this year.

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