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Intel has changed the design of the boxed cooler for Core processors
Insiders have published a snapshot of the standard cooling system for Intel Core processors 12 – th generation. The new Intel RM1 cooler, according to network sources, will be shipped with chips whose TDP does not exceed the value in 78 W.
Earlier, Intel refused to bundle processors with a high thermal package with standard solutions, because for them by default, it is recommended to use more efficient cooling systems. Considering that the “supertower” is not required for the junior models of the Alder Lake family, a new “boxed” cooler with the original shape of the radiator fins and ring LED illumination will be waiting for users.
Insiders do not give the exact list of CPU models with which the Intel RM1 cooling system will be supplied. Intel is expected to hold a presentation of the Alder Lake-S processor family with TDP indicators on January 4 35 and 65 W, and will also introduce system logic sets H 670, B 670 and H610.
Source:
videocardz.com
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