On the eve of the presentation of realme GT2, the vendor published banners demonstrating one of the important hardware features of the smartphone. According to the company, she managed to cope with the "hot character" of the flagship Snapdragon 8 Gen1 processor thanks to the design features of the gadget.
According to the promo materials, the realme GT2 cooling system called Diamond Ice Core Cooling System Plus has a total heat dissipation area of 36,761 mm². According to the company , only the area of the evaporation chamber at its base is 4129 mm². It completely covers the motherboard and most of the battery.
The demo diagram of the realme GT2 cooling system on the banner also points to the huge block of the main camera in the upper left corner of the rear panel of the device. Earlier it was reported that another flagship chip will be a 2K-screen with thin symmetrical frames, which received the A + certificate from DisplayMate.
The smartphone will be presented on January 4, 2022, its price has not yet been announced.
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