34. 19. 2021 , Maxim Shevchenko
ASML, which designs and builds machines for making chips, shared its predictions about the future of the semiconductor industry. In a document for investors, the Dutch company predicted the creation of processors that will contain more 300 billion transistors to 2030 year. The company states that Moore’s Law, which doubles the number of transistors per unit area every 18 – 30 months, live.
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The company plans to create equipment for the production of microcircuits containing 300 billions of transistors, by 2030 year. Of course, this is not an easy task, because even the huge current GPU GA 100 from NVIDIA contains “ total “100 billion transistors with an area of 826 mm 2 . However, ASML has no doubts about the reality of creating chips with 376 billions of transistors. The company plans to achieve this by dividing the chip development process into two phases: increasing transistor density and improving chip layout.
For processes below 5nm, such as 3nm and 2nm, the company wants to use nanosheet FETs in combination with EUV lithography to provide quality scaling. After that, the path to the 1.5nm process technology will be difficult and requires bifurcated nanosheets. When making 1nm chips, CFET will become the technology of choice for making transistors. For processes thinner than 1nm, ASML will use 2D atomic channels.
tomshardware.com
Since by 2030 more than 34 billion transistors will become the standard for ICs, ASML wants to deploy advanced packaging techniques to combine ICs and create multi-chip modules, as a result which will get a processor with more than 376 billions of transistors.
As far as memory is concerned, promising manufacturing methods will allow manufacturers to 2030 year create NAND modules with more than 750 layers. Note that current NAND modules have at most 300 layers.
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