Employees of the technical division of Eurogamer have long monitored the account Fritzchens Fritz from the portal Flickr, which removes chips and chips. And, as it turned out, photographing the processor is not so easy. First it is separated from the main board. Then, using high temperatures, the chip is pulled out of the case. With the help of special solutions, excess layers are removed. And, finally, the photo is enlarged.
We've already seen the Xbox One X processor, but the PS4 Pro is something new. And guess what? They have a lot in common, "- the technical team Digital Foundry.
In general terms, the "heart" of both consoles is similar - they use the same basic designs for CPU and GPU cores, which leaves an imprint on the connection scheme of the processor, the universal controller of RAM and graphics blocks: even externally on the chips there are similar zones in the same places. At the same time, there are enough differences inside the consoles.
The APU crystal installed in the PS4 Pro was 10% smaller than that of the Xbox One X. At the same time, the processor is 40% more productive: it has more computing units (40 against 36) and they work almost a third faster (GPU 911 clock frequency MHz for PS and 1 172 for Xbox). In addition, the attachment from Microsoft has more cache and "RAM", as well as higher throughput of the latter: 12 GB of GDDR5 at speeds up to 326 GB / s are much better suited for games in 4K than 8 GB and 218 GB / s.
With such a tight packing of the chip, it requires serious cooling. To do this, engineers have integrated into the chip a lot of sensors and control elements. APU Xbox One X is riddled with a power monitoring system: if any unit is not used - the operating voltage is reduced to a minimum and the heat dissipation is reduced.
The technical team of DF assumes that Sony and Microsoft are already preparing the next generation of consoles, and it is unlikely to radically change the approach to their architecture. AMD recently presented integrated solutions based on processors and video cards of the latest generation, combining the four-core Ryzen unit and 11 Vega units in a single crystal with an area of approximately 210 square millimeters, and specifically for Intel, Vega embedded processors were built in a more efficient configuration with integrated the HBM2 memory.
Serial production of such chipsets is already underway, and new "hybrids" for laptops and ultracompact PCs are quite capable of competing with consoles in gaming performance: that is, "hardware" is already ready, it remains to wait for specific implementations from Sony and Microsoft.
Cool! Experts compared strictly..
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Yeah dy can be compared, but the best still remain the best, good comparison
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